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DNFSB spots possible bottleneck in Hanford’s waste vitrification
Workers change out spent 27,000-pound TSCR filter columns and place them on a nearby storage pad during a planned outage in 2023. (Photo: DOE)
While the Department of Energy recently celebrated the beginning of hot commissioning of the Hanford Site’s Waste Treatment and Immobilization Plant (WTP), which has begun immobilizing the site’s radioactive tank waste in glass through vitrification, the Defense Nuclear Facilities Safety Board has reported a possible bottleneck in waste processing. According to the DNFSB, unless current systems run efficiently, the issue could result in the interruption of operations at the WTP’s Low-Activity Waste Facility, where waste vitrification takes place.
During operations, the LAW Facility will process an average of 5,300 gallons of tank waste per day, according to Bechtel, the contractor leading design, construction, and commissioning of the WTP. That waste is piped to the facility after being treated by Hanford’s Tanks Side Cesium Removal (TSCR) system, which filters undissolved solid material and removes cesium from liquid waste.
According to a November 7 activity report by the DNFSB, the TSCR system may not be able to produce waste feed fast enough to keep up with the LAW Facility’s vitrification rate.
T. Numakura, T. Cho, J. Kohagura, M. Hirata, R. Minami, Y. Nakashima, K. Yatsu, S. Miyoshi
Fusion Science and Technology | Volume 39 | Number 1 | January 2001 | Pages 277-280
Poster Presentations | doi.org/10.13182/FST01-A11963460
Articles are hosted by Taylor and Francis Online.
A new method is proposed for obtaining radial profiles of both plasma ion (Ti) and electron temperatures (Te) simultaneously using one semiconductor detector array alone. Furthermore, availability of the new idea of the simultaneous Ti and Te diagnostics is experimentally demonstrated by the use of a small-sized semiconductor detector array. This novel method for semiconductor Ti diagnostics is proposed on the basis of an alternative “positive” use of a semiconductor “dead layer” as an energy-analysis filter. Filtering dependence of charge-exchange neutral particles from plasmas on the thickness on the order of nm thick SiO2 layer is used for analyzing Ti ranging from hundreds to thousands eV. In this report, proof-of-principle plasma experiments for the proposed idea are, at first, demonstrated in the GAMMA 10 tandem mirror to verify the availability of this novel idea of distinguishing and identifying each value of Ti and Te by the use of various thin filtering materials. Furthermore, novel experimental data on radial profiles of Ti and Te are simultaneously observed and analyzed using a semiconductor detector array along with the development of a Monte-Carlo computer simulation code for analyzing interactions between semiconductor materials and incident particles. The radial profiles of Ti and Te obtained from semiconductor detectors by the use of the proposed method are found to be in good agreement with those from a charge-exchange neutral-particle Ti analyzer and a microchannel-plate Te detector. Detailed data and analysis method are represented in the paper.