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Materials Science & Technology
The objectives of MSTD are: promote the advancement of materials science in Nuclear Science Technology; support the multidisciplines which constitute it; encourage research by providing a forum for the presentation, exchange, and documentation of relevant information; promote the interaction and communication among its members; and recognize and reward its members for significant contributions to the field of materials science in nuclear technology.
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Utility Working Conference and Vendor Technology Expo (UWC 2024)
August 4–7, 2024
Marco Island, FL|JW Marriott Marco Island
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The Standards Committee is responsible for the development and maintenance of voluntary consensus standards that address the design, analysis, and operation of components, systems, and facilities related to the application of nuclear science and technology. Find out What’s New, check out the Standards Store, or Get Involved today!
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Fusion Science and Technology
Latest News
Vogtle-3 shuts down for valve issue
One of the new Vogtle units in Georgia was shut down unexpectedly on Monday last week for a valve issue that has since been investigated and repaired. According to multiple local news outlets, Georgia Power reported on July 17 that Unit 3 was back in service.
Southern Company spokesperson Jacob Hawkins confirmed that Vogtle-3 went off line at 9:25 p.m. local time on July 8 “due to lowering water levels in the steam generators caused by a valve issue on one of the three main feedwater pumps.”
R.P. Keatch, B. Lawrenson, G. Lyttle
Fusion Science and Technology | Volume 41 | Number 3 | May 2002 | Pages 174-177
Technical Paper | Fourteenth Target Fabrication Specialists' Meeting | doi.org/10.13182/FST02-A17895
Articles are hosted by Taylor and Francis Online.
The field of laser fusion involves the development of new technologies to aid in the fabrication of miniature components used in the target drive system. Current techniques range from cnc lathing with ultra-precise diamond turning to electroplating and mechanical punching. These techniques are labour intensive and are unsatisfactory for many applications. This paper outlines techniques adopted from the microelectronics industry, which have been developed to fabricate these components using a process known as Microengineering. This approach allows the mass-production of these devices with the diversity required to alter dimensions, profile, and material depending on the application 1,2. These microengineering processes have allowed a variety of materials to be investigated with various geometrical features and surface topographies. Using thick photosensitive polymers, combined with electroplating processes, complex 3-D structures have been fabricated in multiple stages.