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Nuclear Energy Conference & Expo (NECX)
September 8–11, 2025
Atlanta, GA|Atlanta Marriott Marquis
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Fusion Science and Technology
Latest News
The RAIN scale: A good intention that falls short
Radiation protection specialists agree that clear communication of radiation risks remains a vexing challenge that cannot be solved solely by finding new ways to convey technical information.
Earlier this year, an article in Nuclear News described a new radiation risk communication tool, known as the Radiation Index, or, RAIN (“Let it RAIN: A new approach to radiation communication,” NN, Jan. 2025, p. 36). The authors of the article created the RAIN scale to improve radiation risk communication to the general public who are not well-versed in important aspects of radiation exposures, including radiation dose quantities, units, and values; associated health consequences; and the benefits derived from radiation exposures.
A. B. Putrik, N. S. Klimov, Yu. M. Gasparyan, V. A. Barsuk, V. S. Efimov, V. L. Podkovyrov, A. M. Zhitlukhin, A. D. Yaroshevskaya, D. V. Kovalenko
Fusion Science and Technology | Volume 66 | Number 1 | July-August 2014 | Pages 70-76
Technical Paper | doi.org/10.13182/FST13-748
Articles are hosted by Taylor and Francis Online.
Edge-localized mode (ELM) simulation experiments were held on the quasi-stationary plasma accelerator QSPA-T to study the formation of plasma-facing material (PFM) erosion products. Parameters of the deuterium plasma heat loads in QSPA-T were close to those expected during transient events in ITER. A diagnostic system for measuring the deposition rate of the erosion products with resolution time of 0.02 ms (pulse duration 0.5 ms) was designed. It allowed defining the deposition rate dependence on time and property changes of the deposited film during the pulse. The average deposition rate in QSPA-T under exposures to ultra-short D plasmas was in the range of (0.1 to 100)×1019 at·cm2·s−1, which was much higher than that for stationary processes. It has been found that deuterium concentration in the deposited W films depends on substrate temperature and deposition rate approximately in the same way as for stationary processes. As the substrate temperature and deposition rate increased, the D/W atomic ratio in the W films decreased. For describing the evolution of the D/W ratio with the substrate temperature and the tungsten deposition rate, an empirical equation proposed by De Temmerman and Doerner (J. Nucl. Mater., 2009), but with alternative parameters, has been used.